Specifications
Model | TS 60 |
Test Space Volume (Cu.Ft/Liters) | 2.1/60 |
Temperature Range | Hot Chamber: +50°C to +220°C Cold Chamber: -80°C to +70°C |
External Width | 35.2″ (895mm) |
External Depth | 77.5″ (1970mm) |
External Height | 74.6″ (1895mm) |
The TS-60 small thermal shock test chamber is ideal for the testing of IC chips and small electronics. Design is constructed of two independently controlled chambers. One chamber is hot and the other one is cold. Product is rapidly transferred between the hot and cold chamber creating a temperature shock of the specimens. The TS Series thermal shock test chamber is the right solution for all your thermal shock testing requirements. These thermal shock chambers meet a variety of test specifications including Mil-Std 810, Mil-Std 883, IEC 60068-2-14, JEDEC and a variety of commercial test standards.
These TS Series Thermal Shock chambers are also in stock! click here.
Model | TS 60 |
Test Space Volume (Cu.Ft/Liters) | 2.1/60 |
Temperature Range | Hot Chamber: +50°C to +220°C Cold Chamber: -80°C to +70°C |
External Width | 35.2″ (895mm) |
External Depth | 77.5″ (1970mm) |
External Height | 74.6″ (1895mm) |
Environmental conditions have a considerable effect on the function and the reliability of electronic components, devices and systems. The main purpose of temperature shock tests is to determine, if sudden temperature changes have an influence on the specimen’s long term function. In addition, early failures due to part and workmanship defects can be provoked without reaching the mechanical and thermal stress limits of the construction.
TS Series Thermal Shock test chamber from Weiss Technik that provides performance and reliability for all your testing requirements.
Click on link below for TS Series video:
Calle Acueducto del Alto Lerma
No. 6 – B
Corredor Industrial
Ocoyoacac, Estado de México